Two-component high-temperature resistant flame-retardant epoxy potting adhesive
Product features and applications JOME 2040A/B is a two-component solvent-free epoxy potting compound that cures at room temperature, with the option for heat-curable applications. This versatile material provides encapsulation protection for high-thermal-conductivity components such as motors, automotive electronics, power tools, reactors, chip heat sinks, and water-cooled radiators, delivering exceptional adhesion and temperature resistance. Excellent bonding and crack resistance
Detailed introduction
TWO COMPONENT, Medium VISCOSITY
Low CTE linear expansion coefficient
High thermal conductivity
Excellent electrical insulation and stability
It can be used for a long time at-50 to 180℃
The water absorption rate is very low, good waterproof and moisture-proof
Technical parameters before and after curing:
Before solidification | Test items test criteria unit PART A PART B | ||
Color measurement black liquid light yellow liquid | |||
Viscosity GB/T 10247-2008 25℃,mPa·s 40,000±10,000 100±50 | |||
Density GB/T 13354-92 25℃,g/cm3 2.6±0.1 0.95±0.05 | |||
Mix ratio mass ratio Ratio=A:B 100 ：5 | |||
Mixing viscosity GB/T 10247-2008 25℃,mPa·s 6,000±1,500 | |||
Operation time GB/T 10247-2008 25℃, min 60 | |||
After curing | Hardness GB/T 531.1-2008 Shore D 90 | ||
Thermal conductivity GB/T W/mK 2.1 | |||
Expansion coefficient GB/T 20673-2006 μm/ (m,℃) | 25, < Tg 62, > Tg | ||
Glass transition temperature DSC ℃ | 95, curing 80℃ 3hr; 105, curing 120℃ 2hr; | ||
Cutting strength GB 6328-86 Cutting strength GB 6328-86 | MPa ，Fe-Fe MPa，Al-Al | ≥10 ≥8 | |
Dielectric strength GB/T 1693-2007 kv/mm (25℃) ≥18 | |||
Loss factor GB/T 1693-2007 (1MHz)(25℃) 0.09 | |||
Dielectric constant GB/T 1693-2007 (1MHz) (25℃) 3.1 3.1 | |||
Volume resistance GB/T 1692-92 DC500V, Ω · cm 1.00E +15 | |||
Use temperature GBT 20028-2005 ℃ -50--180 | |||
Note:
1. The curing condition of the above data test is 80℃*3
h2. The data in the table are measured data under a certain condition for reference only, and there is no guarantee that the data obtained by customers in the actual use process can be completely consistent with it.
Packaging and storage
Component B should be stored in a light and heat free and sealed (can be transported and stored as non-hazardous goods); the storage period is one year.
Component A: 10kg/plastic barrel;
Component B: 0.5kg/pot.
ITEM NO | APPLICATION | PERFORMANCE CHARACTERISTICS |
3102 General purpose | For general electronic components potting and circuit board closure. | Cured bright surface,no cracking, moisture,insulation |
3105 | For high-power electronic components on the heat requirements of the | After the glue has cured heat dissipation, |
3108 | Required for a transparent potting of electronic components and modules, | Room temperature curing, curing after the high |
3115 | For general heat-resistant electronic components potting and circuit | Mixing glue after a long time to use, heated at 80 ℃ in 2 to 3 hours full curing, and could be used at temperature 180 ℃ . |
3112 | For the requirements of flame retardant small and medium-sized electronic | Otherproperties like 3102 |
