
Single-component heat-curing silicone
FEATURES • Semi-flowable, heat cured • Low VOC • High tensile strength • No added solvents BENEFITS • No mixing required • Rapid, versatile cure processing controlled by temperature • Paste, but easy to extruded • Superior sealing achieved with very low outgas COMPOSITION • One part adhesive • Polydimethyl siloxane APPLICATIONS suitable for sealing lids and housings, attaching baseplates, gasketing, connector sealing, engine control, ABS, transmission, and lighting,household appliance.
Detailed introduction
DESCRIPTION
JOME brand one-part heat cure (addition-curing) adhesives cure
rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs.
Addition-cure silicones are formulated with all necessary ingredients for cure and there are no by-products generated during the cure process. Deep-section or confined cures are possible as cure reactions progress evenly throughout the material.
JOME brand adhesives retain their original physical and electrical
properties over a broad range of operating conditions which enhance the reliability and service life of electronic devices.
TYPICAL PROPERTIES
Specification Writers: These values are not intended for use in preparing specifications. Please contact your local JOME sales or distributors before writing specifications on this product.
Property | Unit | Result |
One or Two-part | - | One |
Color | - | White or Black |
Viscosity,4#,10r | mPa.s | 75,000 |
Heat cure time at 120 ºC | Minutes | 60 |
Heat cure time at 150 ºC | Minutes | 30 |
Specific Gravity(Cured) | g/cm3 | 1.03±0.03 |
Tensile Strength | MPa | >2.5 |
Elongation | % | >250 |
Tensile Modulus | MPa | 1.5 |
Tear Strength(Die B) | kN/m | 2.5 |
Durometer Shore A | - | 28 |
Lap shear to Aluminum | MPa | >1.5 |
Dielectric Strength | Kv/mm | 20 |
Thermal conductive | W/K.m | 0.25 |
Volume Resisitivity | Ohm.cm | 2.3E+14 |
Dielectric Constant at 100 Hz | - | 2.9 |
Dissipation Factor at 100 Hz | - | 0.009 |
Working temperature | ºC | -60--250 |
Hardening Transition by DSC | ºC | -55 |
Marked: all value was tested after cured 60mins at 150 ºC.
The adhere strength was quite different if cured under 100 ºC, 125 ºC or 150 ºC.
PREPARING SURFACES
All surfaces should be thoroughly cleaned and/or degreased with naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding.
A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others; users should determine the best techniques for their particular applications.
PACKAGING INFORMATION
10cc and 30cc syringes are
available for this product, also 1kg
and 20kg, 200kg.
| type | model number | Product Description | Color | Viscosity | Pot life 25℃ min,150g | Complete curing time | Hardness | Thermal conductivity | Usage temperature |
| Single component silicone gel | JOMS 5339 | High strength bonding, sealing | White/Grey | Paste like substance | 15±5min | 24h | 35±5A | 0.3w | —60~280℃ |
| JOMS 5106R | High temperature resistant adhesive sealing | red | 20000CPS | 20±5min | 24h | 30±5A | 0.27w | —60~315℃ | |
| JOMS 5133 | High temperature resistant adhesive sealing | red | Paste like substance | 20±5min | 24h | 35±5A | 0.27w | —60~315℃ | |
| JOMS 5316 | 1.0W high thermal conductivity, high-strength bonding, sealing | White/Grey | Paste like substance | 4-8min | 24h | 58±5A | 1.0W | —60~260℃ | |
| JOMS 5317 | 1.5W high thermal conductivity, high-strength bonding, sealing | white | Paste like substance | 5-10min | 24h | 65±5A | 1.5w | —60~260℃ | |
| JOMS 5333 | Conventional fluid sealing, surface encapsulation | White/Black | 8000cps | 3-5min | 24h | 28±5A | 0.45w | —60~260℃ | |
| JOMS 5102 | Conventional fluid sealing, surface encapsulation | Transparent/White/Red | 6000cps | 20-30min | 24h | 26±5A | 0.27w | —60~260℃ | |
| JOMS 5435 | High strength thermosetting silicone | Transparent/White/Grey | Thixotropic Paste like substance | — | 130℃30min | 38±5A | 0.25w | —60~280℃ | |
| JOMS 5420 | High strength thermosetting silicone | Transparent/White/Black | 75,000cps | — | 135℃30min | 30±5A | 0.25w | —60~280℃ | |
| JOMS 5430 | Semi fluid, thermosetting adhesive seal | black | 1000cps | — | 135℃20min | 35±5A | 0.35w | —60~280℃ |



